- All sections
- B - Performing operations; transporting
- B24B - Machines, devices, or processes for grinding or polishing; dressing or conditioning of abrading surfaces; feeding of grinding, polishing, or lapping agents
- B24B 37/20 - Lapping pads for working plane surfaces
Patent holdings for IPC class B24B 37/20
Total number of patents in this class: 508
10-year publication summary
36
|
40
|
82
|
56
|
61
|
50
|
47
|
49
|
31
|
11
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Applied Materials, Inc. | 16587 |
103 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
68 |
Ebara Corporation | 1951 |
64 |
Rohm and Haas Electronic Materials CMP Holdings, Inc. | 309 |
28 |
CMC Materials LLC | 254 |
20 |
Toyo Tire & Rubber Co., Ltd. | 631 |
17 |
Dow Global Technologies LLC | 10147 |
12 |
SK Enpulse Co., Ltd. | 103 |
12 |
Samsung Electronics Co., Ltd. | 131630 |
10 |
Shin-Etsu Handotai Co., Ltd. | 1277 |
7 |
Kioxia Corporation | 9847 |
7 |
NexPlanar Corporation | 15 |
6 |
Tokyo Electron Limited | 11599 |
5 |
Sumco Corporation | 1116 |
5 |
Disco Corporation | 1745 |
4 |
IV Technologies Co., Ltd. | 41 |
4 |
K.C. Tech Co., Ltd. | 78 |
4 |
Nitta Haas Incorporated | 75 |
4 |
Semiconductor Manufacturing International (Shanghai) Corporation | 1764 |
4 |
SKC Co., Ltd. | 311 |
4 |
Other owners | 120 |